Product features and advantages

Heat Conducive Oganosilicon can play a good role in reducing the structural stress and protecting the components when used with electronic components assembly owing to the special technology and silica gel and thermally conductive filler.

It can achieve efficient heat dissipation of heating components on account of its good thermal conductivity, insulation and pressure resistance characteristics and thermal stability, and also it can keep stable work at -40 ℃ ~ 200 ℃, to meet the UL94 V-0 flame retardant grade, in line with the RoHS, REACH environmental requirements, the use of safe and reliable;

in addition, it entails excellent flexibility and resilience, good surface compatibility, easy to assemble, low compression which means lower thermal resistance. Various thickness options, single/double-sided adhesive design are accessible for this material in wide use.

Application 

These materials are mainly used between power devices and heat sinks or machine shells to effectively exclude air and play a good filling and thermal conductivity and heat dissipation function. Its typical applications include automotive electronics, communication equipment, network terminals, storage devices, LED lamps and lanterns, consumer electronics, power supply devices, security equipment and so on.